IDTechEx logo
Access bycompany logo
BETA VERSION
[Old portal version]
Login

Market and Technology Trends in Advanced Semiconductor Packaging

Aug 25, 2022
Market and Technology Trends in Advanced Semiconductor Packaging
Today, data is exploding at every level and in almost every industry. Machine learning and AI are crucial data enablers in a wide range of applications, including data centres, 5G, and autonomous cars. To operate these programmes, a powerful processor is necessary, with an integrated circuit (IC) made on Si serving as the basis.
 
For decades, IC design house would build a chip with all functionalities integrated on a single die; however, as Moore's law slows (chip density are no longer doubling every two years), scaling monolithic IC becomes increasingly complex and costly. This forces IC manufacturers to pursue "advanced semiconductor packaging technologies". In comparison to conventional packaging technologies, advanced semiconductor packaging technologies, such as 2.5DIC and 3DIC, promises higher chip connection and lower power consumption, enabling the IC vendor to continue to supply high performance chips at a reasonable price.
 
In this webinar, Dr. Yu-Han Chang will present IDTechEx's latest data and prospects for the advanced semiconductor packaging industry, which will include research from IDTechEx's latest market research study "Advanced Semiconductor Packaging 2023-2033".
 
This webinar will provide an overview of the current state of the advanced semiconductor packaging industry. The contents include:
  • Analysis of advanced semiconductor packaging markets and their mid-long-term opportunity
  • Key applications' growth drivers
  • Player analysis - the dynamics of advanced semiconductor packaging battleground
  • Advanced semiconductor packaging technologies - current challenges and innovative trends
You need to be logged in
To subscribe, please click here.

Presenter

Technology Analyst

IDTechEx

Downloads:

Market and Technology Trends in Advanced Semiconductor Packaging_PDF (2.3MB)
Market and Technology Trends in Advanced Semiconductor Packaging_Webinar (370.4MB)

You need an active portal subscription to access this content.

Please take a look at our portal subscription information page for the benefits of membership at https://www.idtechex.com/en/research/market-intelligence-subscription

Please contact us for further information about the benefits of IDTechEx subscriptions at
https://www.idtechex.com/en/contact